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  1. NxGEN Electronics; It's in the name.

    NxGen Electronics, Advanced Packaging Technologies
    CSP1
    BGA1
    Tessera1
    ball grid array1
    Nexgen1
    advanced packaging1
    chip scale1
    DDR II1
    FBGA1
    fold-over1
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    UBGA1
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    land grid array1
    3D package1
    integrated passives1
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    ball stack1
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    fine pitch BGA1
    chip scale technology1
    compliant chip1
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    NxGen1
    Nexgen Elect1
    Nexgen Electronics1
    Nxgen Elect1
    NxGen Electronics1
    Nxgen San Diego1

    www.dodgedemonclub.com - 2009-04-03

  2. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
    package design2
    CSP1
    BGA1
    memory modules1
    ball grid array1
    advanced packaging1
    micro BGA1
    chip scale1
    DDR II1
    FBGA1
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    UBGA1
    3D packaging1
    land grid array1
    3D package1
    integrated passives1
    die stacking1
    ball stack1
    die stack1
    fine pitch BGA1
    package solutions1
    chip scale technology1
    compliant chip1
    compliant layer1
    multi-chip1
    MBGA1
    microZ miniaturization1
    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

bga1 fold-over1 fbga1 fine pitch bga1 land grid array1 ball grid array1 csp1 chip scale package1 integrated passives1 die stacking1

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